Silicone Photonics breakthrough by TSMC could help AI
Silicone Photonics - The next chapter of AI computing? TSMC has achieved a milestone in silicon photonics, integrating co-packaged optics (CPO) with advanced semiconductor packaging. This innovation promises to drive the 1.6T optical transmission era by late 2025. Broadcom and NVIDIA are anticipated as early adopters, signaling a transformative leap in high-performance computing (HPC) and AI applications. Key to this breakthrough is the trial production of the micro ring modulator (MRM) using TSMC’s cutting-edge 3nm process. This paves the way for replacing traditional copper interconnects with faster, more efficient optical transmission, overcoming signal interference and heat issues in HPC systems. However, challenges remain in the complex production and packaging of CPO modules. TSMC m...









